At Almhtrf, we know that manual brush cleaning can never reach the debris trapped under BGA chips, especially in water-damaged devices. Enter the XZZ-08L; its industrial vibration head generates high-frequency ultrasonic waves that create millions of microscopic bubbles. These bubbles violently collapse (Cavitation) to shatter and dislodge oils, rust, and dirt from the tightest gaps, restoring the logic board to its pristine condition without harming delicate components.

Technical Specifications & Features:

• Industrial-Grade Transducer: The core is built with high-quality piezoelectric ceramic components, delivering stable, overwhelmingly powerful ultrasonic waves even under heavy loads.

• Leak-proof 304 Stainless Steel Liner: A 1.1mm thick inner tank stamped from a single piece of seamless stainless steel, guaranteeing absolutely zero liquid leakage.

• 360° Deep Cleaning: High-frequency waves deeply penetrate all blind holes and hidden corners, perfect for visually and instantly removing stubborn flux, rosin, and liquid residue.

• One-Click Touch & Safe Design: Quick-start touch operation combined with smooth, chamfered edges to prevent cuts, resting on thickened anti-slip silicone pads to absorb vibrations.

• Smart Heat Dissipation: Engineered with dust-proof ventilation holes that keep internal components cool while drastically reducing the failure rate.

 (Package Includes):

• 1x  (Ultrasonic Cleaning Machine)

• 1x  (Power Cable)

(Disclaimer): It is strictly forbidden to operate the machine while the tank is empty of liquid to prevent burning out the transducer. It is highly recommended to use dedicated PCB cleaning solutions or distilled water with mild detergent, depending on the item being cleaned.