Description

These bending nozzles are specifically designed to upgrade the working experience on 858-class hot air stations. The angled design eliminates the tiring, awkward 90-degree vertical hand posture and strictly prevents heat dispersion from damaging vulnerable neighboring logic board components while working under a microscope.

Technical Specifications & Features:

• Comprehensive Size Range: Available in precision diameters for specific repair tasks:

  • (5mm & 6mm): For microscopic SMD components and delicate jumper wire operations.

  • (8mm & 10mm): The perfect mid-size for standard PMICs, charging ICs, and Wi-Fi modules.

  • (12mm): Designed for safe, broad heat distribution over large CPUs and NAND storage chips.

• The Perfect 45-Degree Angle: Allows you to hold the hot air handle in a natural, highly comfortable “pen-grip” while delivering a perfectly 90-degree vertical airflow directly onto the IC, effectively preventing lightweight SMD components from blowing away.

• Unobstructed Vision: The intelligent curvature keeps the bulky, hot air gun chassis away from your microscope lenses and cameras, granting you a wide, uninterrupted field of view to continuously monitor solder melting.

• 858 Series Compatibility: Engineered with a locking mechanism that perfectly matches the handles of 858 series hot air rework stations (e.g., Quick 858D, generic 858D models), ensuring a secure, leak-free fit.