Description

These bending nozzles are an absolute engineering necessity for any technician performing micro-soldering under a microscope. The angled design entirely eliminates the awkward, tiring 90-degree hand posture and strictly prevents heat dispersion onto vulnerable neighboring logic board components.

Technical Specifications & Features:

• Comprehensive Size Range: Available in precision diameters for every specific repair task:

  • (4mm & 5mm): For microscopic SMD components and tiny jumper traces.

  • (6mm & 8mm): For standard PMICs, charging ICs, and RF chips.

  • (12mm): Designed for broad heat distribution over large CPUs and NAND storage.

• The Perfect 45-Degree Angle: Allows you to hold the hot air handle in a natural, comfortable “pen-grip” while delivering a perfectly 90-degree vertical airflow directly onto the IC, preventing surrounding micro-components from blowing away.

• Microscope Friendly: The intelligent curvature lets you apply direct heat immediately beneath the microscope without the hot air gun colliding with the optics, ensuring an uninterrupted, clear view during component extraction.

• Compatibility: Precision-engineered to fit tightly and securely onto widely popular 857-series hot air rework stations (such as the QUICK 857DW+, QUICK 706W+) and variants sharing the same handle diameter.