Mijing FCD-01 Layered Blade Special for Mobile Phone Motherboard Repair
45.00 LYD
Remove IC and bonding pad black glue
Pry the CPU IC hard drive
Mobile phone motherboard layered special repair knife
In stock
The Mijing FCD-01 Layered Blade is a specialized hand tool for professional mobile phone repair, optimized for motherboard (PCB) level work. It features a brass collet and an aluminum alloy handle for durability and corrosion resistance. The blade is engineered to assist technicians in removing IC and bonding pad black glue, and to pry stubborn CPU and IC components during disassembly and rework. Its layered design improves leverage and control when working in tight spaces on BGA and SMD components. Ideal for black glue removal, pad cleaning, and delicate component extraction without damaging the board.
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