Solder paste is the secret behind any successful micro-soldering operation, and the Luowei SP3 is specifically formulated to meet the strict quality standards of professional technicians. The “Non-Conductive” formula means any residue will absolutely not cause a short circuit between tightly packed IC pads. Additionally, the “No-Resistance” property ensures electrical signals between the CPU and memory transmit without any delay or data loss.

Technical Specifications & Features (By Temperature):

• 138°C (Low Temp): Absolutely perfect for separating and soldering double-layered motherboards, and repairing fragile screen flex cables or Face ID sensors that easily degrade under high heat.

• 183°C (Standard Temp): The primary, standard choice for reballing CPUs, NAND storage, and Power ICs, delivering mechanical durability that withstands the phone’s continuous operating heat.

• Anti-Oxidant Formula: Keeps the solder shiny and strictly prevents it from darkening or losing its properties over time, actively preventing cold solder joints.

• Safe for Traces (Non-Conductive & No-Resistance): A pure formulation that leaves zero carbon or conductive residue that could interfere with sensitive electronic circuits.

• Economical 30g Can: An excellent size for heavy workshop use, packaged in a container designed to prevent rapid drying.

(Disclaimer): To strictly maintain the paste’s quality and perfect viscosity, securely seal the can after each use and store it in a refrigerator (between 0°C and 10°C). Before use, allow it to sit at room temperature for a short period so it can be easily spread over the reballing stencil.