Description
A stencil designed for the middle board of Samsung Z Fold 3 to ensure precision in BGA reballing. Suitable for 0.12 mm thickness work.
16.00 LYD
Specialized stencil for Samsung Z Fold 3 repairs
In stock
A stencil designed for the middle board of Samsung Z Fold 3 to ensure precision in BGA reballing. Suitable for 0.12 mm thickness work.