Description
AMAOE QU9 stencil made from high-quality steel to enhance durability and efficiency in maintenance operations, used for IC re-stenciling in Qualcomm phones like SM8750, SM8635, 8650, and 8550.
– Thickness: 0.12 mm
– Type: BGA Stencil.
19.00 LYD
Stencil used for IC.
In stock
AMAOE QU9 stencil made from high-quality steel to enhance durability and efficiency in maintenance operations, used for IC re-stenciling in Qualcomm phones like SM8750, SM8635, 8650, and 8550.
– Thickness: 0.12 mm
– Type: BGA Stencil.