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SKU: 3132
AMAOE Middle Frame BGA Reballing Stencil Platform For Samsung S23+ S916U/S911
Original price was: 197.00 LYD.177.00 LYDCurrent price is: 177.00 LYD.
Amaoe Samsung Middle Layer Planting Tin Platform with positioning mold, magnet base, and BGA stencil for Samsung S23+ S916U/S911. motherboard soldering repair.
4. Built-in three powerful magnets in the base, which can effectively prevent the stencil from moving slightly, resulting in poor tinning effect.
In stock
Description
1. Built-in strong magnet/using high temperature synthetic stone/precision lamination/continuous upgrade expansion module.
2. Support Samsung series cell phone motherboard tinning and subsequent continuous upgrading, and the base is universal, to avoid repeated purchases.
3. Precision alignment, side slot design, take the steel mesh through the corners to avoid a large area of the mesh at the same time out of the solder paste is taken away.
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