Description
The 2UUL BG02 Universal Reballing Stencil is the “Joker” in any technician’s toolkit. When a specific stencil isn’t available, this versatile tool steps in to handle thousands of different IC footprints with precision.
Features & Specifications:
Square Hole Technology: Unlike traditional round holes, the square aperture design aids in forming flatter, more uniform solder balls and significantly reduces the risk of solder bridging or sticking during lift-off.
Universal Compatibility: Features a wide array of grid patterns and pitches (e.g., 0.3mm, 0.35mm, 0.4mm, 0.5mm, etc.), making it compatible with the vast majority of Power Management Units (PMU), Audio codecs, RF chips, and small BGA components.
Heat Resistance: Crafted from high-quality steel resistant to thermal deformation, ensuring the stencil stays perfectly flat under hot air for consistent reballing results.
CNC Precision: Laser-cut apertures ensure exact solder paste volume deposition for every pad.
Application: The go-to solution for reballing obscure chips or new components where a dedicated stencil is not yet available.
