Description

This comprehensive kit eliminates the need for micro-soldering technicians to purchase individual middle-layer reballing fixtures for every new iPhone generation. The RL-601T intelligently combines 22 precision-engineered components to handle all complex sandwiched logic boards efficiently.

Technical Specifications & Features:

• Comprehensive Coverage (22-in-1): Fully supports the middle-frame reballing of all sandwiched iPhone logic boards, from the iPhone X, 11, 12, 13, 14, 15, all the way to the newest iPhone 16 series (including Pro/Max models).

• Magnetic Precision Alignment: Features an ultra-strong magnetic base that firmly locks the stencil in place during solder paste application. This strictly prevents stencil shifting, eliminating solder bridging and ensuring a flawless layer-to-layer connection.

• Premium Stencils: Includes high-quality, heat-resistant steel stencils that will not warp or bulge under hot air (anti-drumming). The precision CNC-machined holes guarantee perfectly uniform solder balls.

• Durable & Insulated Build: The base plate is constructed from heavy-duty metal and synthetic heat-insulating stone, strictly preventing heat dissipation during hot air rework and protecting the logic board.

• Workflow Efficiency: Drastically speeds up advanced repairs (such as baseband RF issues, board swaps, or fixing separated layers) by providing a clean, error-free reballing environment.