Description
This product represents the cutting edge of micro-soldering clamping technology. The GK-18 and GK-19 models build upon the massive success of the glass series, introducing geometric refinements making them the ultimate choice for handling today’s densely populated, dual-layer smartphone logic boards.
Technical Specifications & Features:
Upgraded Iterations (GK-18 / GK-19): Engineered to provide broader working areas or more versatile locking mechanisms, perfectly accommodating larger, more complex logic boards, alongside dedicated clamping edges for CPUs and NAND flash memory.
Toughened Insulated Glass: The working surface is crafted from heavy-duty industrial glass, exceptionally resistant to the extreme temperatures of hot air rework stations. It prevents heat from dissipating away from the logic board, accelerating component extraction.
Ultra-Easy Cleaning: Say goodbye to flux-soaked metal or stone fixtures; the glass surface entirely repels solder paste and rosin, ensuring your workbench remains spotless and professional.
Smart Thermal Design: Features meticulously integrated grooves for hot air circulation and efficient heat dissipation, strictly protecting the logic board from localized thermal stress.
Concealed, Durable Locking Mechanism: The spindle and guide rails are shielded from flux and debris, ensuring a long operational lifespan and unwavering stability during aggressive underfill scraping.
