At Almhtrf, we know the secret to first-time reballing success lies strictly in the quality of the solder paste. The MaAnt paste offers an advanced formula integrated with pure Flux to prevent oxidation and ensure smooth flow through micro-stencils. The three available temperatures provide optimal choices for tackling any repair scenario, preventing both heat damage to sensitive components and fragile cold solder joints.

Technical Specifications & Features (By Temperature):

• 138°C (Low Temp): A (Sn42/Bi58) composition perfectly suited for highly heat-sensitive repairs, such as sandwiching iPhone double-layered middle frames, and repairing Face ID or screen flex cables without causing thermal damage.

• 158°C (Medium Temp): A balanced, excellent choice for modern PCBs and delicate components requiring moderate heat, effectively preventing damage to nearby plastic or fragile elements during hot air application.

• 183°C (Standard/High Temp): A (Sn63/Pb37) formula offering immense mechanical and electrical durability. The ultimate standard for reballing CPUs, Power ICs, and NAND storage, fully capable of withstanding the phone’s high operating temperatures without losing structural integrity.

• Integrated Flux Quality: Contains active flux that strictly prevents solder splatter under direct hot air, leaving minimal, easy-to-clean residue (No-Clean formula).

 (Disclaimer): To maintain the paste’s viscosity and prevent it from drying out, it is highly recommended to store it in a refrigerator (between 0°C and 10°C). Before use, take it out and leave it at room temperature for 30-45 minutes so it returns to its perfect, spreadable consistency.