Description
– Special stencil for reballing BGA ICs in Samsung Galaxy S7 phones.
– Supports Exynos 8890 and MSM8996 processors.
– Provides precise alignment during reballing operations.
- All categories
- KBS Screens
- Powercell Battery
- Repair Tools
- Spare parts
- Apple
- Samsung
- Huawei
- Microscopes
- Xiaomi
- Brand
- Super Discount
- Accessories
