Description

The AMAOE HW10 stencil is used for reballing BGA ICs in devices with Kirin810/Hi6280 processors like Honor 9X and Nova5. Made of heat-resistant steel with precision openings for accurate connections and supports thermal soldering.
– Suitable for Huawei phones with Kirin810/Hi6280 processors
– Made of heat-resistant steel
– CNC design for high temperature resilience