AMAOE Stencil Huawei HU3
16.00 LYD
Stencil for Huawei phones
In stock
– AMAOE HU3 stencil made of strong steel.
– Used for precise BGA reballing.
– Precise openings compatible with processors and RAM solder grid.
– Supports HiSilicon Kirin processors such as Kirin 9000, Kirin 990, Kirin 980, and Kirin 970.
– Suitable for CPU/RAM reballing in Huawei models like Mate 20, P20, and others.
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MAECENAS IACULIS
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