Amaoe IP17 3-in-1 Middle Layer Reballing Platform – iPhone 17 Series
185.00 LYD
3-in-1 Magnetic Reballing Platform for iPhone 17 Series logic boards. Features precise positioning and high-quality steel stencils for accurate middle-layer soldering and sandwich board repair.
In stock
Technical Specifications: A high-precision specialized tool designed for advanced motherboard repairs (Layering/Separation).
Brand: Amaoe.
Model: IP17 (3-in-1 Set).
iPhone 17
iPhone 17 Pro
iPhone 17 Pro Max
iPhone 17 Plus (if applicable within the 3-in-1 layout).
Material: High-temperature resistant synthetic stone base + Magnetic positioning + High-grade steel stencil.
Technical Specifications: A high-precision specialized tool designed for advanced motherboard repairs (Layering/Separation).
Brand: Amaoe.
Model: IP17 (3-in-1 Set).
Material: High-temperature resistant synthetic stone base + Magnetic positioning + High-grade steel stencil.
Function: Reballing the middle frame (interposer) of the split logic board (Sandwich Board) before reuniting the layers.
Key Features:
3-in-1 Design: Supports the entire series (iPhone 17, 17 Pro, 17 Pro Max) in one compact platform.
Magnetic Alignment: Strong magnetic base ensures the stencil stays perfectly aligned with the motherboard pads, preventing solder bridging.
Heat Resistance: The base is made of synthetic stone that dissipates heat effectively and prevents board deformation during hot air application.
Precision Mesh: Square-hole stencil design prevents solder balls from sticking or becoming too large.
Compatibility:
Function: Reballing the middle frame (interposer) of the split logic board (Sandwich Board) before reuniting the layers.
Key Features:
3-in-1 Design: Supports the entire series (iPhone 17, 17 Pro, 17 Pro Max) in one compact platform.
Magnetic Alignment: Strong magnetic base ensures the stencil stays perfectly aligned with the motherboard pads, preventing solder bridging.
Heat Resistance: The base is made of synthetic stone that dissipates heat effectively and prevents board deformation during hot air application.
Precision Mesh: Square-hole stencil design prevents solder balls from sticking or becoming too large.
Compatibility:
iPhone 17
iPhone 17 Pro
iPhone 17 Pro Max
iPhone 17 Plus (if applicable within the 3-in-1 layout).
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