AMAOE HW9 Stencil for Huawei Description
– Design: U-QSD7
– Usage: BGA reballing
– Compatible with: Snapdragon 750/765G/SM7250/7125/7225/6115/6350/6375/4375/4250
16.00 LYD
Stencil designed for reballing Qualcomm Snapdragon chips
In stock
– Design: U-QSD7
– Usage: BGA reballing
– Compatible with: Snapdragon 750/765G/SM7250/7125/7225/6115/6350/6375/4375/4250
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