– AMAOE HU3 stencil made of strong steel.
– Used for precise BGA reballing.
– Precise openings compatible with processors and RAM solder grid.
– Supports HiSilicon Kirin processors such as Kirin 9000, Kirin 990, Kirin 980, and Kirin 970.
– Suitable for CPU/RAM reballing in Huawei models like Mate 20, P20, and others.
