YCS NAND / eMMC / UFS Memory Green Oil & BGA Reballing Stencil (BGA 60 to 315)
20.00 LYD
Professional dual-function YCS stencil dedicated to BGA reballing and precise green oil (UV mask) application for smartphone memory chips (NAND/eMMC/UFS). Supports a massive range of BGA sizes from 60 to 315 for both iPhone and Android. The ultimate solution for professionally repairing and insulating damaged hard drive pads.
In stock
This product is an indispensable tool for micro-soldering technicians specializing in storage upgrades, dead boot repairs, and critical data recovery. It masterfully combines precision reballing and reliable trace insulation into a single stencil.
Technical Specifications & Features:
Comprehensive BGA Support: Covers a massive range encompassing virtually all smartphone and tablet memory chip sizes: (BGA 60, 70, 110, 153, 162, 169, 178, 200, 221, 254, 297, 315). This includes iPhone NANDs (e.g., BGA110) and Android eMMC/UFS chips (e.g., BGA254, BGA153).
Dual-Function Design: Effortlessly reball memory ICs while utilizing dedicated precision cutouts to flawlessly apply UV green oil over rebuilt or damaged motherboard pads, ensuring perfect insulation before chip installation.
High-Precision CNC Machining: Crafted from premium steel that resists heat-induced warping and bulging (anti-drumming), guaranteeing perfectly uniform solder balls and actively preventing frustrating solder bridging.
Logic Board Rescue: The ultimate stencil for rebuilding torn memory pads securely and rapidly, significantly increasing the success rate of complex board swaps and resolving hardware-level software errors.
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