FoneKong Solder Paste
15.00 LYD
Solder paste for phone applications
| Model | 138 ,183 |
|---|
– Known for excellent adhesion capability
– Suitable for BGA, PGA, and CSP applications
– Ideal for precise phone circuit repairs
– Melting point: 183°
– Package size: 42 grams
– Particle precision: 20-38 microns
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