Amaoe PM1 BGA Stencil
16.00 LYD
Stencil for BGA IC rework.
In stock
The Amaoe PM1 stencil is designed for reworking BGA ICs. Made from heat-resistant steel with a thickness of 0.15 mm, it supports various Qualcomm PMIC ICs like PM8018, PM8921, and others, ensuring precise solder paste alignment and enhancing work quality.
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