AMAOE Stencil SAM1
16.00 LYD
Tool designed for Samsung chip stenciling.
In stock
– Stencil designed for BGA chip reballing for Samsung.
– Made of heat-resistant steel with a thickness of 0.12mm.
– Precisely applies to solder points for processors like Exynos 8895.
– Suitable for repeated use in professional workshops.
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MAECENAS IACULIS
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