Description

This platform is the perfect tool to ensure precise IC reballing success on the first attempt. The unique curved design of the BH12 solves the issue of steel stencil warping. The extensive magnetic force tightly pulls the stencil flush against the chip, strictly preventing solder paste from bleeding between pads and ensuring perfect solder ball distribution.

Technical Specifications & Features:

• Strong Magnetic Force: Ensures a remarkably firm and stable fit between the stencil and the platform, eliminating any shifting during solder paste application.

• Curved Surface Design: A precise geometric design that creates a seamless, gap-free fit with the stencil, guaranteeing highly accurate chip and paste placement.

• High Temperature Resistance: Crafted from high-temp resistant materials capable of easily withstanding intense welding environments, ensuring long-term stable operation under hot air.

• Wide Compatibility: Perfectly suitable for 2UUL series and universally compatible stencils (e.g., iPhone 17 T0.12, Kirin 9000S T0.12). Ideal for soldering and repairing mobile phone chips, PCB mid-layer frames, computer chips, and ECU chips.

• Dimensions & Weight: Features a net weight of 155g and highly practical, compact dimensions (62mm × 82mm × 11mm).