Description
The 2UUL BG03 stencil is the must-have tool for micro-soldering technicians preparing to repair Apple’s latest generation devices. The pinpoint accuracy of its apertures guarantees perfectly even solder paste application over the ultra-tight IC tracks of the iPhone 17 series, significantly increasing reballing success rates and reducing repair time.
Technical Specifications & Features:
Full iPhone 17 Series Compatibility: Meticulously designed to perfectly match the pinouts and schematics of critical ICs for the entire iPhone 17 series (Standard, Pro, Pro Max).
Laser-Cut Apertures: Ultra-precise CNC machined holes prevent solder paste clumping and ensure smooth paste release, resulting in perfectly uniform solder ball sizes.
Premium Stainless Steel: Crafted from high-grade steel that easily withstands the intense heat of hot air stations without expanding or warping, maintaining a perfectly flat surface.
Optimal Thickness: The stencil features a carefully calculated thickness to create solder balls at the correct height, ensuring robust and excellent electrical connectivity for the IC.
(Disclaimer): For best results and to prolong stencil life, it is recommended to clean it immediately after use with alcohol and a soft wipe. Avoid using sharp tools to scrape off remaining solder paste to prevent scratching or expanding the apertures.
