2UUL BG01 ABCD 4-in-1 BGA Reballing Stencil Set for iPhone 8 to 16 Pro Max (4 Pcs/Pack)
69.00 LYD
Complete 4-piece BGA stencil set (A/B/C/D) covering iPhone 8 to iPhone 16 Pro Max. Supports CPU (A11-A18), NAND, Wi-Fi, Baseband, and Face ID chips. High-precision 0.12mm square-hole design for perfect reballing.
In stock
Product Overview: The 2UUL BG01 ABCD set is the ultimate reballing solution for professional technicians. This kit includes 4 distinct stencils (labeled A, B, C, D) that collectively cover almost every chip on iPhone logic boards from generation 8 up to the latest 16 Pro Max. It eliminates the need to buy separate stencils for each model, offering a comprehensive “All-in-One” solution for CPUs, Memory, and small ICs.
Key Features:
Full Range Coverage: Supports models: iPhone 8/8P/X/XS/XR/11/12/13/14/15/16 Series (including Pro & Pro Max).
4 Specialized Stencils:
Stencil A: Focuses on CPU (A11 to A18/Pro) and NAND Flash (Hard Disk).
Stencil B: Dedicated to Baseband (Network) and Wi-Fi modules.
Stencil C: Covers RF (Radio Frequency), Power Amplifiers (PA), and Audio ICs.
Stencil D: Designed for Face ID, Display IC, Camera, and small peripheral chips.
Square Hole Design: Features precise square openings instead of round ones, ensuring easier solder ball release and preventing balls from sticking.
High Precision: 0.12mm thickness with stepped grooves ensures perfect alignment with the chip pads.
Durable Material: Made from high-quality steel that resists deformation under high heat.
Specifications:
Brand: 2UUL
Model: BG01 (ABCD Set)
Quantity: 4 Pieces / Pack
Compatibility: iPhone 8 – 16 Pro Max
Material: Stainless Steel (0.12mm)
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