Description
The YCS ORAGON ARC mat is designed to withstand high temperatures and is ideal for use in BGA IC soldering. It provides an insulating surface to improve heat dissipation and direction efficiently.
25.00 LYD
Mat designed to resist heat during BGA IC soldering.
In stock
The YCS ORAGON ARC mat is designed to withstand high temperatures and is ideal for use in BGA IC soldering. It provides an insulating surface to improve heat dissipation and direction efficiently.
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