Description
YCS 4 in 1 solder paste is used for BGA CPU reballing. It features three different melting points: 138℃, 183℃, and 199℃.
– Weight: 50 grams.
– Suitable for mobile board repair.
79.00 LYD
Specialized solder paste for BGA CPU reballing
Out of stock
YCS 4 in 1 solder paste is used for BGA CPU reballing. It features three different melting points: 138℃, 183℃, and 199℃.
– Weight: 50 grams.
– Suitable for mobile board repair.