AMAOE HW2 Stencil for Huawei Devices
1 × 16.00 LYD 
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AMAOE EMMC2 BGA Reballing Stencil for EMMC/EMCP/UFS Chips
1 × 19.00 LYD Subtotal: 51.00 LYD
16.00 LYD
Stencil designed for Qualcomm Snapdragon chips
In stock
AMAOE U-QSD8 stencil designed for reballing Qualcomm Snapdragon chips with high precision. Made of polished steel to ensure durability and effective use in Qualcomm processor repairs.
– Material: Polished Steel
– Usage: Suitable for Qualcomm processors
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