Description
– Special stencil for reballing BGA ICs in Samsung Galaxy S7 phones.
– Supports Exynos 8890 and MSM8996 processors.
– Provides precise alignment during reballing operations.
– Special stencil for reballing BGA ICs in Samsung Galaxy S7 phones.
– Supports Exynos 8890 and MSM8996 processors.
– Provides precise alignment during reballing operations.