Original price was: 55.00 LYD.5.00 LYDCurrent price is: 5.00 LYD.
Tool designed for iPhone 6G BGA reballing
In stock
The Mijing 3D Stencil is designed for maintenance technicians for reballing board components like CPU and NAND. It features a thickness of 0.025mm and consistent thermal distribution, facilitating precise application of solder paste and reducing deformation during heating.
