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AMAOE EMMC Universal Reballing Stencil for EMMC/EMCP/UFS ICs
1 × 16.00 LYD Subtotal: 40.00 LYD
16.00 LYD
Stencil for Qualcomm Snapdragon IC reballing
In stock
AMAOE U-QSD4 stencil is designed for reballing Qualcomm Snapdragon ICs. Suitable for multiple IC models and used in mobile board maintenance.
– Dimensions: 0.12 mm
– Model: U-QSD4
– Usage: Mobile board reballing
– Supports multiple IC models
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