AMAOE EMMC Universal Reballing Stencil for EMMC/EMCP/UFS ICs Description
– Stencil designed for reballing Qualcomm Snapdragon processor boards.
– Made of stainless steel for durability.
– Suitable for use in workshops and professional centers.
16.00 LYD
Tool designed for Qualcomm Snapdragon processors
In stock
– Stencil designed for reballing Qualcomm Snapdragon processor boards.
– Made of stainless steel for durability.
– Suitable for use in workshops and professional centers.
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