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16.00 LYD
Stencil for Qualcomm Snapdragon chips
In stock
The AMAOE U-QSD2 stencil is specifically designed for reballing Qualcomm Snapdragon chips. Made of stainless steel, it offers durability and precision for effective soldering, making it ideal for professionals in mobile board maintenance.
– Material: Stainless steel
– Suitable for BGA chip reballing
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