– Stencil designed for PMIC power ICs bga reballing for Huawei phone models like HI6421, HI6523, Hi6551, and HI6555.
– Made of stainless steel with a thickness of 0.12mm.
– Heat-resistant and provides consistent solder distribution.
– Precise holes for perfect solder alignment.
– Supports leaded and lead-free solder.
– Helps prevent stencil warping.
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