RELIFE 4 in 1 Optical Fingerprint Calibrator RL-071B
1 × 57.00 LYD 
2UUL TW01 Hand Finish 3D Tweezer for Precise Phone Repair
1 × 49.00 LYD 
AMAOE Stencil PM3
1 × 16.00 LYD 
Mijing 3D Stencil for iPhone 6G
1 × 5.00 LYD Subtotal: 127.00 LYD
– Stencil designed for BGA reballing on Samsung phones.
– Made of stainless steel with a thickness of 0.12 mm.
– Laser-cut holes for precise solder paste distribution.
– Supports chips like Exynos 7870, 7884, 7885, 7904, 9610, and 9611.
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