Description
AMAOE QU5 Stencil in 0.12mm thickness, used for maintenance and reballing Qualcomm CPU chips. Compatible with SDM710, SM6150, MSM8917, SDM845, SM8150, and SDM670 chips.
– Includes one stencil.
– Thickness of 0.12mm for precise repairs.
19.00 LYD
A tool for reballing Qualcomm CPU chips
In stock
AMAOE QU5 Stencil in 0.12mm thickness, used for maintenance and reballing Qualcomm CPU chips. Compatible with SDM710, SM6150, MSM8917, SDM845, SM8150, and SDM670 chips.
– Includes one stencil.
– Thickness of 0.12mm for precise repairs.
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