- iPhone
- iPhone 6
- iPhone 6 Plus
- iPhone 6S
- iPhone 6S Plus
- iPhone 7
- iPhone 7 Plus
- iPhone 8
- iPhone 8 Plus
- iPhone SE (2020)
- iPhone X
- iPhone XR
- iPhone XS
- iPhone XS Max
- iPhone 11
- iPhone 11 Pro
- iPhone 11 Pro Max
- iPhone 12
- iPhone 12 Mini
- iPhone 12 Pro
- iPhone 12 Pro Max
- iPhone SE (2022)
- iPhone 13
- iPhone 13 Mini
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- iPhone 13 Pro Max
- iPhone 14
- iPhone 14 Plus
- iPhone 14 Pro
- iPhone 14 Pro Max
- iPhone 15
- iPhone 15 Plus
- iPhone 15 Pro
- iPhone 15 Pro Max
- iPhone 16
- iPhone 16 Plus
- iPhone 16 Pro
- iPhone 16 Pro Max
- iPhone 16e
- BGA Stencils
- 3D Stencil
تم إضافة “Amaoe A13 Stencil iPhone 11 11PRO 11PRO MAX” إلى سلة مشترياتك. عرض السلة

Mechanic LS720 Ultra High Lumen Microscope Polarization Ring Light 179.00 د.ل السعر الأصلي هو: 179.00 د.ل.149.00 د.لالسعر الحالي هو: 149.00 د.ل.

AMTECH Flux 100g USA 67.00 د.ل
RELIFE RL-601MA CPU Repair Fixture Set/IP Series (A8-A17)
197.00 د.ل السعر الأصلي هو: 197.00 د.ل.167.00 د.لالسعر الحالي هو: 167.00 د.ل.
RELIFE RL-601MA 9 in 1 Universal CPU Reballing Stencil Platform iPhone CPU Lower Layer Tin Planting Platform Set For A8-A16 iPhone 6~14 Pro Max IC Chip Planting Tin Template Fixture, Universal CPU Reballing Stencil Platform RL-601MA for iPhone 6 to 14Pro Max A8/A9/A10/A12/A13/A14/A15/A16 IC Chip Planting Tin Template Fix.
متوفر في المخزون
رمز المنتج: 3097 التصنيفات: BGA Stencils, Brand, RELIFE
الوصف
iPhone CPU tin planting platform set suitable for A8/A9/A10/A11/A12/A13/A14/A15/A16 CPU.
Round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls.
Automatic and precise alignment / Universal chip slot structure / Integration of positioning / Glue removal / Tin planting.
Using a new type of magnetic power original positioning, strong magnetic automatic clamping, convenient and flexible, support for a variety of CPU maintenance positioning, stable and reliable clamping.
Built-in high-temperature magnet, strong magnetic adsorption, precise positioning, no offset, high-temperature magnetic unchanged.
General more IC clamps such as chip CPU/hard disk/font library; place the chip fixedly in the upper left corner of the chip slot (let the magnetic suction module automatically withstand the edge of the chip, which can cover the corresponding chip tin-planting steel stencil.
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