YCS ORAGON ARC PAD BGA IC Soldering Heat-Resistant Mat
25.00 د.ل
YCS Universal Insulation Tin-Plating Curved Pad for Mobile Phone Motherboard CPU IC BGA Soldering Heat Dissipation Mat Cushion
YCS ORAGON ARC pad (0.3mm 0.45mm 0.77mm).
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MAECENAS IACULIS
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